
NXP Semiconductors
PESDxV4UK series
Very low capacitance unidirectional quadruple ESD protection arrays
11. Soldering
1.05
0.5
0.6
(6 × )
(6 × )
solder resist
1.4
0.7
solder land plus
solder paste
occupied area
Dimensions in mm
0.15
(6 × )
0.25
(6 × )
0.35
sot891_fr
Reflow soldering is the only recommended soldering method.
Fig 12. Reflow soldering footprint SOT891
PESDXV4UK_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 August 2010
? NXP B.V. 2010. All rights reserved.
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